CMP, also called thermal oxidation polishing, makes use of MP in conjunction with chemicals to improve the MRR and improve area quality [twenty]. Figure two illustrates the schematic of a typical CMP process [21]. The SiC wafer, that is set within the provider, as well as sharpening pad go relative https://www.facebook.com/permalink.php?story_fbid=pfbid0YUx5gnWXKYpDdf4zZk9dagBnHDWXdmfYSKKbYe4g51gyU5jdQ8jNVAQcdH6jE5jjl&id=61562415773754&__cft__[0]=AZVQRBH89egHZ9zUXrup0rUzNx2chOEfnhEmoV1AJVWzuIWOV1HMyrwmY1gmmB6L2aN8RrcWI_EX2pEtUBA3BW28dXt2MwT-Zteu3hLWf3D_7AvXTNPMmaZk2AeFPaR2hM4kAjobJyz6IGFkiOe6y51jRfkxTRY92OVVytQrzyDSpF59ivTLaUIMvvt8hvXYRoI0KMuId3bwnBfnVek3Xu1K&__tn__=%2CO%2CP-R